Committees

Honorary Chairs

• Jian-Nong Cao, Hong Kong Polytechnic University, Hong Kong

• Han-Chieh Chao, National Dong Hwa University, Taiwan

Advisory Board

• Steven Guan, Xi’an Jiaotong-Liverpool University, China

• Hui-Huang Hsu, Tamkang University, Taiwan

• Paolo Prinetto, Politecnico di Torino, Italy

• Massimo Poncino, Politecnico di Torino, Italy

• Joongho Choi, University of Seoul, South Korea

• Michel Schellekens, University College Cork, Ireland

• M L Dennis Wong, Heriot-Watt University, Scotland

• Vladimir Hahanov, Kharkov National University of Radio Electronics, Ukraine

• Chun-Cheng Lin, National Chiao Tung University, Taiwan

• Chien-Chang Chen, Tamkang University, Taiwan

General Chairs

• Ka Lok Man, Xi’an Jiaotong-Liverpool University, China

• Young B. Park, Dankook University, Korea

Local Chair

• Chi-Yi Lin, Tamkang University, Taiwan

Industrial Liaison Chair

• Gangming Li, Xi’an Jiaotong-Liverpool University, China

Publicity Chairs

• Vincent Ng, The Hong Kong Polytechnic University, Hong Kong

• Neil Y.(Yuwen) Yen, The University of AIZU, Japan

• Patrick HangHui Then, Swinburne University of Technology Sarawak, Malaysia

Program/Workshop Chairs

• Tomas Krilavičius, Vytautas Magnus University, Lithuania

• Seungmin Rho, Sungkyul University, South Korea

• Yujia Zhai, Xi’an Jiaotong-Liverpool University, China

• Woonkian Chong, SP Jain School of Global Management, Singapore

• Owen Liu, Xi’an Jiaotong-Liverpool University, China

• Jie Zhang, Xi’an Jiaotong-Liverpool University, China

• Gabriela Mogos, Xi’an Jiaotong-Liverpool University, China

• Kamran Siddique, Xiamen University, Malaysia

Program Committee

• Alberto Macii, Politecnico di Torino, Italy

• Wei Li, Fudan University, China

• Emanuel Popovici, University College Cork, Ireland

• Jong-Kug Seon, System LSI Lab., LS Industrial Systems R&D Center, South Korea

• Umberto Rossi, STMicroelectronics, Italy

• Franco Fummi, University of Verona, Italy

• Graziano Pravadelli, University of Verona, Italy

• Yui Fai Lam, Hong Kong University of Science and Technology, Hong Kong

• Jinfeng Huang, Philips &LiteOn Digital Solutions Netherlands, The Netherlands

• Jun-Dong Cho, Sung Kyun Kwan University, South Korea

• Gregory Provan, University College Cork, Ireland

• Miroslav N. Velev, Aries Design Automation, USA

• M. Nasir Uddin, Lakehead University, Canada

• Dragan Bosnacki, Eindhoven University of Technology, The Netherlands

• Milan Pastrnak, Siemens IT Solutions and Services, Slovakia

• John Herbert, University College Cork, Ireland

• Zhe-Ming Lu, Sun Yat-Sen University, China

• Jeng-Shyang Pan, National Kaohsiung University of Applied Sciences, Taiwan

• Chin-Chen Chang, Feng Chia University, Taiwan

• Mong-Fong Horng, Shu-Te University, Taiwan

• Liang Chen, University of Northern British Columbia, Canada

• Chee-Peng Lim, University of Science Malaysia, Malaysia

• Salah Merniz, Mentouri University, Constantine, Algeria

• Oscar Valero, University of Balearic Islands, Spain

• Yang Yi, Sun Yat-Sen University, China

• Damien Woods, University of Seville, Spain

• Franck Vedrine, CEA LIST, France

• Bruno Monsuez, ENSTA, France

• Kang Yen, Florida International University, USA

• Takenobu Matsuura, Tokai University, Japan

• R. Timothy Edwards, MultiGiG, Inc., USA

• Olga Tveretina, Karlsruhe University, Germany

• Maria Helena Fino, Universidade Nova De Lisboa, Portugal

• Adrian Patrick ORiordan, University College Cork, Ireland

• Grzegorz Labiak, University of Zielona Gora, Poland

• Jian Chang, Texas Instruments, Inc, USA

• Yeh-Ching Chung, National Tsing-Hua University, Taiwan

• Anna Derezinska, Warsaw University of Technology, Poland

• Kyoung-Rok Cho, Chungbuk National University, South Korea

• Yuanyuan Zeng, Wuhan university, China

• D.P. Vasudevan, University College Cork, Ireland

• Arkadiusz Bukowiec, University of Zielona Gora, Poland

• Maziar Goudarzi, Sharif University of Technology, Iran

• Jin Song Dong, National University of Singapore, Singapore

• Dhamin Al-Khalili, Royal Military College of Canada, Canada

• Zainalabedin Navabi, University of Tehran, Iran

• Lyudmila Zinchenko, Bauman Moscow State Technical University, Russia

• Muhammad Almas Anjum, National University of Sciences and Technology (NUST), Pakistan

• Deepak Laxmi Narasimha, University of Malaya, Malaysia

• Danny Hughes, Katholieke Universiteit Leuven, Belgium

• Jun Wang, Fujitsu Laboratories of America, Inc., USA

• A.P. Sathish Kumar, PSG Institute of Advanced Studies, India

• N. Jaisankar, VIT University. India

• Atif Mansoor, National University of Sciences and Technology (NUST), Pakistan

• Steven Hollands, Synopsys, Ireland

• Siamak Mohammadi, University of Tehran, Iran

• Felipe Klein, State University of Campinas (UNICAMP), Brazil

• Eng Gee Lim, Xi’an Jiaotong-Liverpool University, China

• Kevin Lee, Deakin University, Australia

• Prabhat Mahanti, University of New Brunswick, Saint John, Canada

• Kaiyu Wan, Xi’an Jiaotong-Liverpool University, China

• Tammam Tillo, Xi’an Jiaotong-Liverpool University, China

• Yanyan Wu, Xi’an Jiaotong-Liverpool University, China

• Wen Chang Huang, Kun Shan University, Taiwan

• Masahiro Sasaki, The University of Tokyo, Japan

• Shishir K. Shandilya, NRI Institute of Information Science & Technology, India

• J.P.M. Voeten, Eindhoven University of Technology, The Netherlands

• Wichian Sittiprapaporn, Mahasarakham University, Thailand

• Aseem Gupta, Freescale Semiconductor Inc., Austin, TX, USA

• Kevin Marquet, Verimag Laboratory, France

• Matthieu Moy, Verimag Laboratory, France

• RamyIskander, LIP6 Laboratory, France

• Chung-Ho Chen, National Cheng-Kung University, Taiwan

• Kyung Ki Kim, Daegu University, Korea

• Shiho Kim, Chungbuk National University, Korea

• Hi Seok Kim, Cheongju University, Korea

• Brian Logan, University of Nottingham, UK

• AsokeNath, St. Xavier’s College (Autonomous), India

• Tharwon Arunuphaptrairong, Chulalongkorn University, Thailand

• Shin-Ya Takahasi, Fukuoka University, Japan

• Cheng C. Liu, University of Wisconsin at Stout, USA

• Farhan Siddiqui, Walden University, Minneapolis, USA

• Katsumi Wasaki, Shinshu University, Japan

• Pankaj Gupta, Microsoft Corporation, USA

• Masoud Daneshtalab, University of Turku, Finland

• Boguslaw Cyganek, AGH University of Science and Technology, Poland

• Yeo Kiat Seng, Nanyang Technological University, Singapore

• Tom English, Xlinx, Ireland

• Nicolas Vallee, RATP, France

• Rajeev Narayanan, Cadence Design Systems, Austin, TX, USA

• Xuan Guan, Freescale Semiconductor, Austin, TX, USA

• Pradip Kumar Sadhu, Indian School of Mines, India

• FeiQiao, Tsinghua University, China

• Chao Lu, Purdue University, USA

• Ding-Yuan Cheng, National Chiao Tung University, Taiwan

• Pradeep Sharma, IEC College of Engineering & Technology, Greater Noida, GB Nagar UP, India

• Ausra Vidugiriene, Vytautas Magnus University, Lithuania

• Lixin Cheng, Suzhou Institute of Nano-Tech and Nano-Bionics (SINANO), Chinese Academy of Sciences, China

• Yue Yang, Suzhou Institute of Nano-Tech and Nano-Bionics (SINANO), Chinese Academy of Sciences, China

• Yo-Sub Han, Yonsei University, South Korea

• Hwann-Tzong Chen, National Tsing Hua University, Taiwan

• Michele Mercaldi, EnvEve, Switzerland

• Valliapan Raman, Swinburne University of Technology Sarawak, Malaysia

Important Dates

Paper submission deadline:

6 November 2023

Notification of acceptance: 

20 November 2023

Camera-ready deadline:

3 December 2023

Author registration:

13 December 2023

Conference Dates:

20-22 December 2023